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      2. CIS

        ASMPT provides innovative and cost-effective solutions that help you successfully meet the industry’s demand for faster and powerful devices.

        AUTOPIA

        Automatic Active Alignment System (for Automotive Camera Application)

        COSMOS

        Automatic 3D Sensing Alignment System

        Eagle AERO

        For High-end IC Applications

        Lens Holder Attach System

        IS600GS

        Automatic Active Alignment Bonding System for Camera Module Assembly

        Lens Holder Attach System

        IS868LA3

        Automatic Lens Holder Attach System

        DI-water Cleaning System

        ISCM868S

        Automatic DI-Water Cleaning System

        ISLinDA

        Automatic Die Bonding System (12” wafer handling)

        Ball Bonder OPTO/LED Wire Bonding Equipment

        Harrier Xtreme

        Dual-Head Extreme High Speed Wire Bonder

        OPTO/LED Wire Bonding Equipment

        iHawk Xpress XL

        Wire Bonder

        Ball Bonder OPTO/LED Wire Bonding Equipment

        iHawk Xtreme

        Wire Bonder

        Strip Form Substrates AOI System

        VIM300 / IS-VIM300

        Automated Optical Inspection

        Other Applications

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